BEST BST-082 For iPhone 13 Series CPU Soldering Reballing Stencil Cell Phone Magnetic Tinning Plate

•There is a strong magnet embedded in the base,and strong magnetic adsorption,so that the positioning is accurate,does not deviate,and the magnetism does not change at high temperatures •High temperature resistant,not easy to deform,non-sticky,easy to get off the net •Every tin dot is as full as a pearl. Suitable for iPhone 13 series motherboard mid-layer repair •Strong magnetic adsorption for a tight fit. With precise positioning alignment holes for more convenience •CNC high-precision integrated processing,stencil and pad precision alignment stable positioning scraping tin ball implantation without deviation Compatible with: •Universal Models Package included: •1 x Set of CPU Soldering Reballing Stencil