BGA Reballing Stencil Template Stainless Steel IC Chip Tin Planting Template for A12 CPU

Feature: 1. [APPLICABLE MODEL] This BGA reballing template is very useful for Phone XR, for Phone XS, for Phone XS MAX with A12 CPU. 2. [FAST TINNING] This type of rework stencil is fast, the spherical stencil does not change at high temperatures, and the positioning is precise. 3. [SEMI CARVING PROCESS] The semi engraving process is used to provide multiple IC slots on the main body of the stencil, effectively preventing small ICs from sticking to the tin and ensuring that small ICs do not break the corners. 4. [STAINLESS STEEL] This rework net is made of stainless steel, hard and wear resistant and not easy to deformation, long life. 5. [COMPACT AND PORTABLE] These rework net is compact, easy to carry around, long lasting and very convenient. Specification: Item Type: BGA Reballing Stencil Template Material: Stainless steel Pitch: 0.12mm Applicable CPU: A12 Applicable Product Models: For Phone XR, for Phone XS, for Phone XS MAX. Package List: 1 x BGA Reballing Stencil Template [APPLICABLE MODEL] This BGA reballing template is very useful for Phone XR, for Phone XS, for Phone XS MAX with A12 CPU. [FAST TINNING] This type of rework stencil is fast, the spherical stencil does not change at high temperatures, and the positioning is precise. [SEMI CARVING PROCESS] The semi engraving process is used to provide multiple IC slots on the main body of the stencil, effectively preventing small ICs from sticking to the tin and ensuring that small ICs do not break the corners. [STAINLESS STEEL] This rework net is made of stainless steel, hard and wear resistant and not easy to deformation, long life. [COMPACT AND PORTABLE] These rework net is compact, easy to carry around, long lasting and very convenient.